Part 10/15:
Tesla’s and Cerebrus’s wafer-scale architectures leverage TSMC’s production capacity for large, integrated chips. Still, manufacturing bottlenecks persist: demand dwarfs supply, leading companies like Nvidia to outbid competitors or overpay for chips and memory modules.
In terms of scaling to massive datasets and models, innovations like chiplet-based designs could be crucial, enabling the combination of multiple optimized chips rather than monolithic systems, thus enhancing flexibility and scalability.