Advanced Packaging Market 2018-2023 Analysis & Forecast Report: By Region, Application, Type, and Keyplayers

Global Advanced Packaging Market with market overview, segmentation by types, potential applications and production analysis. The expert analyst provides information regarding definitions, classifications, comprehensive analysis, applications, and as well as key factors that contributes in the market’s growth

During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.

Meanwhile, advanced packaging has become a technology priority for the Chinese semiconductor industry, according to the high-level policy framework released by the State Council of the People’s Republic of China in June 2014. The council aims to have advanced packaging account for about 30 percent of all packaging revenues earned by Chinese vendors by 2015.

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The Key Manufacturers Covered:
• ASE
• Amkor
• SPIL
• Stats Chippac
• PTI
• JCET
• J-Devices
• UTAC
• Chipmos
• Chipbond and More....

The commercial reality for most integrated-circuit (IC) manufacturers is that node migrations and changes in wafer sizes are slowing down even as capital expenditures are increasing. One way for manufacturers to preserve their edge on their circuits’ small sizes, low costs, and high performance is to incorporate newer chip-packaging options such as 2.5-D integrated circuits (2.5DICs) and 3-D integrated circuits (3.0DICs) into their production processes. These advanced-packaging technologies, many of which are still in their infancy, promise greater chip connectivity and lower power consumption compared with traditional packaging configurations.

This report also splits the market by region:
• Americas
• United States
• Canada
• Mexico
• Brazil
• APAC
• China and More…

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Segmentation by product type:
• 3.0 DIC
• FO SIP
• FO WLP
• 3D WLP
• WLCSP
• 2.5D
• Filp Chip

Segmentation by application:
• Automotives
• Computers
• Communications
• LED
• Healthcare
• Other

Research objectives
• To understand the structure of Advanced Packaging market by identifying its various subsegments.
• Focuses on the key global Advanced Packaging manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
• To analyze the Advanced Packaging with respect to individual growth trends, future prospects, and their contribution to the total market.
• To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
• To project the consumption of Advanced Packaging submarkets, with respect to key regions (along with their respective key countries) and More…

Table of Contents
1 Scope of the Report
1.1 Market Introduction
1.2 Research Objectives
1.3 Years Considered
1.4 Market Research Methodology
1.5 Economic Indicators
1.6 Currency Considered

2 Executive Summary
2.1 World Market Overview
2.1.1 Global Advanced Packaging Consumption 2013-2023
2.1.2 Advanced Packaging Consumption CAGR by Region
2.2 Advanced Packaging Segment by Type
2.2.1 3.0 DIC
2.2.2 FO SIP
2.2.3 FO WLP
2.2.4 3D WLP
2.2.5 WLCSP
2.2.6 2.5D
2.2.7 Filp Chip
2.3 Advanced Packaging Consumption by Type
TOC Continued….!

Tables And Figures
• Figure Picture of Advanced Packaging
• Table Product Specifications of Advanced Packaging
• Figure Advanced Packaging Report Years Considered
• Figure Market Research Methodology
• Figure Global Advanced Packaging Consumption Growth Rate 2013-2023 (K MT)
• Figure Global Advanced Packaging Value Growth Rate 2013-2023 ($ Millions)
• Table Advanced Packaging Consumption CAGR by Region 2013-2023 ($ Millions) and More….

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