Part 5/9:
Unfortunately, while Intel floundered, competitors like TSMC rapidly advanced, utilizing newer technologies such as Extreme Ultraviolet Lithography (EUV). By 2021—when Intel was just beginning to roll out its IDM strategy—TSMC was already producing more advanced microchips at 5nm and even 3nm nodes, creating a noticeable gap in technological capability.
A Crisis of Trust
The fundamental challenges of manufacturing were compounded by a deeper issue: trust. Unlike TSMC, which dedicated itself to serving external clients, Intel faced skepticism from other tech giants. With operations straddling both chip design and manufacturing, potential partners viewed Intel as a competitor rather than a collaborator.