Part 4/8:
The presenters showcased several methods for accessing silicon, emphasizing both physical and chemical techniques. Physical methods include using vices to apply pressure, while chemical methods involve the use of solvents and acids to dissolve package materials systematically.
Mechanical Methods
Participants learned basic mechanical preparation techniques, such as using a vice and screwdrivers to open hard packages. This guided the audience toward an understanding that substantial pressure can yield valuable results, allowing for direct access to silicon chips without needing advanced tools.