Part 7/9:
One of the most profound shifts in recent years has been toward three-dimensional (3D) transistor design. Unlike traditional flat transistors, 3D designs, such as finFET structures, offer improved cooling and reduced energy consumption. Companies like Intel are exploring technologies like Foveros Direct, which can significantly increase transistor density by stacking chips vertically. Nevertheless, managing heat in these compact structures poses a major difficulty, requiring the development of advanced cooling systems.