Part 5/10:
New Light Source: Russia's EUV machine utilizes a slightly shorter wavelength of 11.2 nanometers, enabling the etching of smaller, more precise features onto silicon wafers. This advancement could lead to the production of more powerful and energy-efficient chips suited for next-generation applications, such as 5G and AI.
Xenon-Based Laser: Instead of ASML's complex tin droplet method, which relies on costly processes, Russia's light source employs a simplified xenon-based laser system. This innovation could make production cheaper and more efficient, presenting a cost advantage over ASML systems.