Part 6/10:
Elimination of Photo Masks: Traditionally, photo masks—used to project light patterns onto silicon wafers—are expensive and time-consuming to create. Russia's machine circumvents this by directly etching onto the silicon wafer, thus streamlining the manufacturing process and reducing costs.
Silicon-Based Photo Resists: Russia's technology incorporates silicon-based photo resists, rather than the more expensive materials typically used in EUV lithography. This could significantly lower production costs and increase accessibility to advanced chip manufacturing.