Part 3/8:
This necessity reflects a broader understanding that off-the-shelf hardware isn't enough for the future of AI. Custom chips, optimized for workload-specific performance, are becoming essential rather than optional.
Strategic Collaboration: Co-Development of Chips and Networks
Charlie Cowas, President of Broadcom, provided insights into the innovative nature of this collaboration, which he describes as a "trifecta" of technological integration:
Custom Accelerated Chips: Building specialized AI accelerators, GPUs, or XPUs tailored for OpenAI’s workloads.
Open Ethernet Networks: Linking these accelerators through industry-standard Ethernet protocols to ensure scalable, flexible data movement.