Part 6/10:
While many might attribute the AI revolution to Nvidia’s GPUs or Tesla’s self-driving hardware, TSMC’s role in fabricating these chips makes it foundational. But what truly sets TSMC apart is its advanced packaging technology, which is pivotal in boosting AI system performance.
The Power of Advanced Packaging
- Chip-on-Wafer-on-Substrate (CoWoS): This technology creates highly integrated chiplets with ultra-high bandwidth and low latency, allowing multiple die stacks to function as a unified system. TSMC controls about 90% of the global CoWoS market, with demand more than doubling in 2024.