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RE: LeoThread 2024-10-22 09:10

in LeoFinance11 months ago

What is CoWoS?

CoWoS (Chip-on-Wafer-on-Substrate) is a packaging technology that integrates multiple chips onto a single substrate, which is then packaged into a final product. This technology allows for the creation of high-performance computing and AI components that can be used in a wide range of applications, including data centers, cloud computing, and edge computing.