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     11 months ago  

    What is CoWoS?

    CoWoS (Chip-on-Wafer-on-Substrate) is a packaging technology that integrates multiple chips onto a single substrate, which is then packaged into a final product. This technology allows for the creation of high-performance computing and AI components that can be used in a wide range of applications, including data centers, cloud computing, and edge computing.

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       11 months ago  

      The CoWoS technology involves several key components:

      1. Wafer: A silicon wafer is used as the substrate for the package.
      2. Chips: Multiple chips are mounted onto the wafer, which can include CPUs, GPUs, and other semiconductor devices.
      3. Packaging material: A material, such as plastic or ceramic, is used to encapsulate the chips and wafer.
      4. Interface: The package includes interfaces, such as connectors and pads, that allow the package to be connected to other components.
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         11 months ago  

        Advantages of CoWoS

        The CoWoS technology offers several advantages over traditional packaging methods, including:

        1. Increased density: CoWoS allows for the creation of high-density packages that can contain multiple chips.
        2. Improved performance: By integrating multiple chips onto a single substrate, CoWoS enables the creation of high-performance computing and AI components.
        3. Reduced power consumption: CoWoS packages can be designed to reduce power consumption, which is critical for applications that require low power consumption.
        4. Increased reliability: CoWoS packages can be designed to be more reliable than traditional packages, which can improve overall system reliability.
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           11 months ago  

          TSMC's CoWoS capabilities

          TSMC is a leading manufacturer of semiconductor devices and packaging technology. The company's CoWoS capabilities involve the use of advanced equipment and processes to produce high-quality packages. TSMC's CoWoS technology is designed to meet the needs of high-performance computing and AI applications, and the company is constantly working to improve its CoWoS capabilities.

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             11 months ago  

            TSMC's CoWoS expansion plans

            As mentioned earlier, TSMC has announced plans to expand its CoWoS capabilities in response to growing demand for high-performance computing and AI components. The company's expansion plans include:

            1. Doubling production capacity: TSMC plans to double its production capacity for CoWoS packaging technology year-over-year in both 2024 and 2025.
            2. Increasing capacity: TSMC expects its monthly packaging volume to reach around 35,000 to 40,000 wafers by the end of 2024 and a further surge to roughly 80,000 wafers in 2025.
            3. Switching to rectangular substrates: TSMC plans to switch from conventional round wafers to rectangular substrates to increase the number of chips that can be placed on each wafer.
            4. Investing in new equipment: TSMC is investing in new equipment, including wet process equipment, to support its CoWoS expansion plans.
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               11 months ago  

              Impact of TSMC's CoWoS expansion plans

              TSMC's CoWoS expansion plans are expected to have a significant impact on the industry. The company's suppliers, including GPTC and Scientech, are already benefiting from the growth in demand for CoWoS equipment, and it is likely that they will continue to do so as the CoWoS segment expands.

              The growth of the CoWoS segment is driven primarily by the increasing demand for high-performance computing and AI components. Major AI players are relentlessly driving demand for cutting-edge chips with advanced packaging, and TSMC's CoWoS technology is well-positioned to meet this demand.

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                 11 months ago  

                Conclusion

                TSMC's CoWoS technology is a critical component of the company's strategy to meet the growing demand for high-performance computing and AI components. The company's expansion plans, which include doubling production capacity and switching to rectangular substrates, are expected to have a significant impact on the industry. As the demand for CoWoS equipment continues to grow, it is likely that TSMC's suppliers will continue to benefit from the growth in demand.

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